Infineon and SCHWEIZER collaborate on more efficient silicon carbide automotive solutions

May. 1, 2023 /SemiMedia/ — Infineon Technologies AG and Schweizer Electronic AG have announced an innovative approach to further improve the efficiency of silicon carbide (SiC)-based chips.

The two partners are developing a solution that embeds Infineon’s 1200 V CoolSiC™ chip directly on a printed circuit board (PCB), which will increase the range and reduce the total system cost of electric vehicles.

The two companies have already demonstrated the potential of this new approach: They were able to embed a 48 V mosfet in the PCB. This resulted in a 35 percent increase in performance. SCHWEIZER contributes to this success with its innovative p²Pack® solution which enables power semiconductors to be embedded in PCBs.

“Our joint goal is to take automotive power electronics to the next level,” said Robert Hermann, Product Line Head Automotive High-voltage Discretes and Chips, of Infineon. “The low-inductive environment of a PCB allows clean and fast switching. Combined with the leading performance of 1200 V CoolSiC™ devices, chip embedding enables highly integrated and efficient inverters that reduce overall system costs.”

“With Infineon’s 100 percent electrically tested standard cells (S-Cell), we can achieve high overall yields in the p² Pack manufacturing process,” said Thomas Gottwald, Vice President Technology at Schweizer Electronic AG. “The fast-switching characteristics of the CoolSiC chips are optimally supported by the low-inductance interconnection that can be achieved with the p² Pack. This leads to increased efficiency and improved reliability of power conversion units such as traction inverters, DC-DC converters, or on-board chargers.”

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